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IEC/TR 62878-2-7 Ed. 1.0 en:2019

IEC/TR 62878-2-7 Ed. 1.0 en:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

standard by International Electrotechnical Commission - Technical Report, 03/20/2019

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IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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Edition: 1.0 Published: 03/20/2019 Number of Pages: 12 File Size: 1 file , 2.6 MB